CPUs / Compare

AMD Ryzen 7 260 vs Qualcomm Snapdragon X Plus X1P-42-100

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Product A: AMD

Ryzen 7 260

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B

Product B: Qualcomm

Snapdragon X Plus X1P-42-100

29 of 74 known

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Every value links to where we found it.

Only differences

AAMD Ryzen 7 260

BQualcomm Snapdragon X Plus X1P-42-100

General

6 of 13 differ

Series

Ryzen 200 Series1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Series row: Ryzen 200 Series.

Snapdragon X Plus1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026Qualcomm's Snapdragon X Plus 8-core product brief (DCN 87-82546-1 Rev C). Its SKU comparison table lists the platform as Snapdragon X Plus.

Model numbersiMaker identifiers for this exact model and its listed variants. Excludes sibling models and other generations.

100-000001384, 100-000001322, 100-000001311, 100-0000017241Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Product ID Tray rows: 100-000001384 (FP7), 100-000001322 (FP7r2), 100-000001311 (FP8 8000) and 100-000001724 (FP8 200). AMD lists no boxed product.

X1P-42-1001Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026SKU comparison table, row Snapdragon X Plus: part number X1P-42-100. The same table lists X1P-66-100, X1P-64-100 and X1P-46-100, which are other products.

GTIN / EAN

Not available

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AnnouncediThe maker's first announcement of this model. This is separate from first retail availability.

6 January 20253Press articletomshardware.com/pc-components/cpus/amd-launches-ryzen-ai-300-and-200-series-chips-for-laptopsRead 14 October 2026Tom's Hardware, 6 January 2025 (CES): AMD announces the Ryzen 200 series, codenamed Hawk Point Refresh, with the Ryzen 7 260 at 8 cores and 16 threads, up to 5.1 GHz, 3.8 GHz base and 35 to 54 W cTDP. It gives no price and says Q2 2025 for the Ryzen 200 series.

4 September 20244Press articlelaptopmag.com/laptops/qualcomm-announces-the-snapdragon-x-plus-8-core-chipset-at-ifaRead 15 October 2026Laptop Mag, 4 September 2024: Qualcomm announced the 8-core Snapdragon X Plus in a keynote ahead of IFA Berlin. The article names the two SKUs, X1P-46-100 and X1P-42-100. CNBC wrote the same day that Qualcomm launched the processor on Wednesday 4 September 2024.

Status

Available1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Product is listed and current on AMD's page. Form Factor lists Laptops and Desktops, and the chip stays laptop.

Available5Retailer pagecdw.com/product/microsoft-surface-laptop-for-business-13-inch-copilot-pc-13-qualc/8371324Read 15 October 2026CDW listing of the Microsoft Surface Laptop for Business 13-inch (EP2-33447) with Qualcomm Snapdragon X Plus X1P-42-100, up to 3.4 GHz, with an Add To Cart button. It shows the chip in a laptop that is on sale.

PredecessoriThe model this one directly replaced, in the same line, tier and size, as the maker or a trusted review names it.

Not available

Not available

SuccessoriThe model that directly replaced this one, in the same line, tier and size. A revision such as a Slim or OLED model does not count when a next generation exists.

Not available

Qualcomm Snapdragon X2 Plus X2P-42-1007Reviewnotebookcheck.net/Qualcomm-Snapdragon-X2-Plus-X2P-42-100-Processor-Benchmarks-and-Specs.1196970.0.htmlRead 23 October 2026Notebookcheck's X2P-42-100 page calls the 8-core X1P-42-100 the predecessor of the X2P-42-100.

Launch price (US)iThe maker's US launch MSRP for the stated configuration, excluding tax. Current store prices and later discounts do not qualify.

Not available

Not available

Launch price (EU)iThe maker's euro launch price for the stated configuration, including VAT as published. Current store prices and later discounts do not qualify.

Not available

Not available

MarketsiISO country or region codes where this exact model or variant is sold. A source page's language does not establish availability.

Not available

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ColoursiThe maker's own colour names

Not available

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SegmentiThe segment the chip maker sells it in. Intel calls laptop chips Mobile. AMD laptop chips that also list Desktops, for mini PCs, stay laptop.

Laptop1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Form Factor lists Laptops and Desktops. AMD laptop chips that also list Desktops stay laptop.

Laptop1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026The brief describes the processor as powering Copilot+ PCs and laptops.

Instruction setiApple and Qualcomm chips are Arm64. Intel and AMD chips are x86-64.

x86-641Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Supported Extensions list x86-64.

Arm643Press articlecnx-software.com/2024/09/09/qualcomm-snapdragon-x-plus-8-core-a-4ghz-octa-core-processor-for-entry-level-copilot-pcs-and-laptopsRead 15 October 2026CNX Software, 9 September 2024: the specification list names an 8-core 64-bit Armv8 Oryon processor with 30 MB cache, and gives the X1P-42-100 a max multi-core frequency of 3.2 GHz and a single-core boost of 3.4 GHz.

CodenameiThe chip maker's codename. Intel: the Code Name row without "Products formerly". AMD: the Former Codename row without the socket.

Hawk Point1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Former Codename row reads Hawk Point. Press calls the Ryzen 200 series Hawk Point Refresh and the chip a rebadged Ryzen 7 8845HS.

Not available

CPU process (as published)iVerbatim name of the process the CPU cores are made on, e.g. TSMC N3B or Intel 18A.

TSMC 4nm FinFET1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Processor Technology for CPU Cores: TSMC 4nm FinFET. Package Die Count is 1.

4nm1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026Process Node: 4nm. The brief names no foundry.

CPU process nodeiThe nm class of the named CPU-core process, as on laptops and desktop PCs: TSMC N3B is 3, Intel 7 is 10, Intel 4 is 7 and Intel 18A is 1.8. The exact name is in CPU process (as published). I/O and graphics dies may use other nodes.

4nm1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026

4nm1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026Process Node: 4nm.

AVX-512iThe chip maker lists AVX-512 among the supported instruction extensions.

Yes1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Supported Extensions list includes AVX512.

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Cores and clocks

4 of 7 differ

Core configurationiOne row per core group the chip maker names. Intel names performance, efficient and low-power efficient cores. AMD names Zen 5 and Zen 5c cores. Qualcomm names prime and performance cores.

AAMD Ryzen 7 260

Count	Core	Base clock (GHz)	Max clock (GHz)
8	Zen 4	3.8	5.1

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026AMD names no core roles. Processor Architecture is Zen 4 and # of CPU Cores is 8. Base Clock 3.8 GHz is AMD's average effective base frequency of all cores. Max. Boost Clock is the highest single-core clock, Up to 5.1 GHz.

BQualcomm Snapdragon X Plus X1P-42-100

Count	Core	Max clock (GHz)
8	Oryon	3.4

Source1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026Qualcomm Oryon CPU, 64-bit architecture, 8 cores, 30 MB total cache. The table gives the X1P-42-100 a max multi-core frequency of 3.2 GHz and a single-core boost of 3.4 GHz. The brief states no base clock and no performance or efficiency roles. Stored as one group with the 3.4 GHz boost as its max clock. Total cache is not split into L2 and L3, so both cache fields are left out.

CoresiPhysical cores, not threads.

8=CalculatedFrom Core configuration

8=CalculatedFrom Core configuration

Cores labelled performanceiCounts only cores the chip maker labels performance. Not available when the maker labels no roles, as on AMD chips. Qualcomm and Apple use other labels for their fastest cores.

Not available

Not available

Cores labelled efficiencyiCounts efficient and low-power efficient cores. Not available when the maker labels no roles.

Not available

Not available

ThreadsiHardware threads, including simultaneous multithreading where the chip has it.

161Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Multithreading (SMT) Yes, # of Threads 16.

86Spec databasegeektopia.es/es/product/qualcomm/snapdragon-x-plus-x1p-42-100Read 15 October 2026Geektopia lists 8 total cores and 8 threads for the X1P-42-100. Qualcomm's brief states no thread count. The page has other values that differ from Qualcomm's own, such as a GPU turbo clock of 1400 MHz and 2.15 TFLOPS, so only the thread count is used. No second source was opened for it.

Max boost clockiHighest clock the chip maker states for the processor, Intel Max Turbo Frequency or AMD Max. Boost Clock. Often reached on one or two cores only. It can be higher than every core group's max clock.

5.1GHz1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026

3.4GHz1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026Boost Frequency (Single-Core) 3.4 GHz for the X1P-42-100. The max multi-core frequency is 3.2 GHz.

Unlocked for overclockingiThe core multiplier is unlocked, as on Intel K models and AMD chips listed as Unlocked for Overclocking. Memory profiles such as XMP or EXPO alone do not count.

No1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Unlocked for Overclocking: No.

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Cache

3 of 3 differ

L2 cacheiTotal L2 cache of all cores.

8MB1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026L2 Cache 8 MB.

Not available

L3 cacheiTotal L3 cache, including 3D V-Cache. Intel Smart Cache is L3. L2 is not added. A total cache figure from Qualcomm or Apple is not L3.

16MB1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026L3 Cache 16 MB. AMD's CES table lists 24 MB, which is L2 plus L3 together.

Not available

AMD 3D V-CacheiExtra L3 cache stacked on a compute die. Yes when at least one compute die has it.

No1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026AMD lists 16 MB L3 and no stacked cache.

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Power and thermals

3 of 4 differ

Base power (TDP)iIntel Processor Base Power or AMD Default TDP. A rating for cooler and board design, not measured power draw. A Default TDP printed as a range, such as 35-54 W, is not stored.

45W1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Default TDP 45W.

Not available

Max turbo poweriHighest package power limit at stock settings. Intel Maximum Turbo Power, or AMD's package power tracking (PPT) limit. The source note says which. Only a source that names this exact chip counts. A database value applied to a whole class of chips does not.

Not available

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Configurable power rangeiThe sustained power range a PC or laptop maker may set. AMD cTDP. Intel Minimum and Maximum Assured Power.

Minimum35Maximum54W1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026AMD Configurable TDP (cTDP) 35-54W.

Not available

Max operating temperatureiHighest die temperature the chip maker allows, called Tjmax or Tjunction. The chip lowers its clocks to stay below it.

100°C1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Max. Operating Temperature (Tjmax) 100 C.

Not available

Memory

5 of 6 differ

Memory supportiOfficial memory speeds per memory type, module type and module configuration, as the chip maker states them.

AAMD Ryzen 7 260

Memory type	Module type	Modules	Max speed (MT/s)
DDR5	Not available	4x2R	5,600
LPDDR5X	Soldered	Not available	7,500

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026System Memory Type: DDR5 (FP8), LPDDR5X (FP8), LPDDR5X (FP7) and DDR5 (FP7r2). The Max Memory Speed row is labelled 4x2R and reads DDR5-5600 and LPDDR5x-7500, so the DDR5 row keeps that label. AMD names no module type for DDR5. LPDDR5X is soldered to the board and has no module configuration.

BQualcomm Snapdragon X Plus X1P-42-100

Memory type	Max speed (MT/s)
LPDDR5X	8,448

Source1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026Memory Type: LPDDR5x with Transfer Rate 8448 MT/s. The brief names no module type or configuration, so those are left out.

Max memory speed (official)iHighest official speed in the memory support table, for any module type. Four modules or plain UDIMMs can run slower. Intel quotes some chips with CUDIMM speeds only.

7,500MT/s=CalculatedFrom Memory support

8,448MT/s=CalculatedFrom Memory support

Memory channelsiCounted in 64-bit channels, as Intel and AMD count them. A DDR5 module has two 32-bit subchannels and makers count it as one channel. A maker that counts narrower channels and states their width is converted by the total bus width, so Qualcomm's 8 channels of 16 bits are 2. A total bus width alone is divided by 64, so AMD's 256-bit interface is 4. The maker's own count goes in the source note.

21Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Memory Channels 2.

21Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026Memory section: Number of Channels 8 with Bit Width 16-bit per channel, which is 128 bits in total. The field counts 64-bit channels, so 128 bits is stored as 2. Qualcomm's own count is 8.

Memory bandwidth (claimed)iPeak memory bandwidth the chip maker states. Not a measurement.

Not available

135GB/s1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026Bandwidth: 135 GB/s.

Max memoryiMost memory the chip maker says the processor supports. When the limit depends on the device, as for Apple chips, the highest limit the maker states for this chip in any device. The device goes in the source note. When Intel's documents differ, such as 192 GB in a launch brief and 256 GB on its spec page, the current spec page wins, since newer memory modules can raise the limit.

96GB1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Max Memory Size by Type: DDR5 96 GB and LPDDR5 64 GB. The higher figure is stored.

64GB1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026Capacity: Up to 64 GB.

ECC memory supportiThe chip maker says the processor supports ECC memory. Most need a board that supports it too. DDR5 on-die ECC does not count.

No1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026ECC Support: No.

Not available

Platform

5 of 7 differ

Socket or packageiDesktop socket, e.g. AM5 or LGA1851. Laptop chips are soldered, so this is the package the maker names, e.g. FP8. When the maker names several packages, in the socket row or the product IDs, list them all separated by commas, such as "FP7, FP7r2".

FP8, FP7r2, FP71Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026CPU Socket row lists FP8, FP7r2 and FP7, stored in AMD's order.

Not available

Compatible chipsetsiDesktop chipsets the chip maker lists, with the brand and without the word chipset, e.g. AMD X870E, AMD B850 or Intel Z890. Same form as the motherboard chipset.

Not available

Not available

CPU PCIe lanesiUsable PCIe lanes from the processor, one row per PCIe generation. Lanes that link the CPU to the chipset are not counted. If the maker gives only a total, a review that lists the split may be used, and the source note names it. When the package also holds the chipset, as on Intel Raptor Lake U and H chips, ARK's total includes the chipset lanes. Those are not counted, so the datasheet split is used. On Intel Core Ultra chips, such as Panther Lake, the platform controller or SoC tile is part of the processor, so its lanes count.

AAMD Ryzen 7 260

PCIe generation	Lanes
4	20

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026PCI Express Version is PCIe 4.0. Native PCIe Lanes (Total/Usable) is 20 and 20.

BQualcomm Snapdragon X Plus X1P-42-100

Not available

CPU PCIe lanes in totaliUsable lanes from the processor. Lanes to the chipset are not counted.

20=CalculatedFrom CPU PCIe lanes

Not available

Highest PCIe generationiHighest PCIe generation of the processor's own lanes. Chipset lanes are not counted.

4=CalculatedFrom CPU PCIe lanes

Not available

Native USB portsiUSB ports the processor itself provides, as the chip maker lists them. The board or laptop decides which ones reach a connector. Chipset ports are not counted. eUSB2 is the embedded USB 2.0 link that Qualcomm lists. It needs a repeater on the board to become a USB 2.0 port.

AAMD Ryzen 7 260

Standard	Count
USB4	2
USB 3.2 Gen 2 (10 Gbps)	2
USB 2.0	4

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Native USB 4 (40Gbps) 2, Native USB 3.2 Gen 2 (10Gbps) 2 and Native USB 2.0 (480Mbps) 4.

BQualcomm Snapdragon X Plus X1P-42-100

Standard	Count
USB4	3
USB 3.2 Gen 2 (10 Gbps)	2
eUSB2	1

Source1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026USB Specification Version USB 4.0. Interface Type: 3 x USB4 (40Gbps), 2 x USB3.2 Gen2x1 and 1 x eUSB2. The list sits in the brief's shared specification column for the 8-core X Plus.

Native USB4 or ThunderboltiThe processor itself provides USB4 or Thunderbolt. The board or laptop must still wire it to a port.

Yes=CalculatedFrom Native USB ports

Yes=CalculatedFrom Native USB ports

Integrated graphics

6 of 9 differ

Integrated graphicsiNo for chips that need a graphics card, such as Intel F models.

Yes1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026

Yes1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026The brief has an Adreno GPU section and gives the X1P-42-100 up to 1.7 TFLOPS.

Integrated GPUiAs the chip maker names it.

AMD Radeon 780M1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Graphics Model: AMD Radeon 780M.

Qualcomm Adreno X1-452Maker product pagequalcomm.com/laptops/products/snapdragon-x-plusRead 15 October 2026Specifications: GPU part number X1-85 for X1P-66-100 and X1P-64-100, and X1-45 for X1P-46-100 and X1P-42-100. The X1P-42-100 column reads GPU part number X1-45. The GPU name is Qualcomm Adreno.

GPU coresiAs the chip maker counts them: AMD compute units, Intel Xe-cores, Apple GPU cores. Counts from different makers are not comparable. Intel execution units (EUs) are not Xe-cores and are not stored here. Apple sells some chips with two GPU core counts under one name, so it is per variant.

121Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Graphics Core Count 12.

Not available

Max GPU clockiIntel Graphics Max Dynamic Frequency or AMD Graphics Frequency.

2,700MHz1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Graphics Frequency 2700 MHz.

1,250MHz2Maker product pagequalcomm.com/laptops/products/snapdragon-x-plusRead 15 October 2026X1P-42-100 column: GPU clock speed Up to 1.25 GHz, stored as 1250 MHz. The X1P-46-100 has up to 1.40 GHz.

Max displaysiDisplays the integrated GPU drives at the same time. The chip maker's total. Intel counts a built-in laptop panel in it. A count of external displays only, as Qualcomm gives, is left out and goes in the source note.

41Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Max Displays 4.

Not available

DisplayPort versioniHighest DisplayPort version the integrated GPU outputs, with the UHBR rate when stated.

2.1 UHBR101Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026DisplayPort Version 2.1 with the UHBR10 extension.

1.41Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026Max. External Display Resolution: DP v1.4 with 3 displays up to UHD60 Hz HDR10, or 2 displays up to 5K60 or UHD120. The internal panel uses eDP v1.4b. The brief counts external displays only and says nothing about how many run at once with the internal panel, so the max displays field is left out. It states no HDMI version.

HDMI versioniHighest HDMI version the integrated GPU outputs, as published.

2.11Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026HDMI Version 2.1.

Not available

Hardware video encodeiCodecs the chip maker states the integrated GPU encodes in hardware.

H.264, H.265 (HEVC), AV11Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Max Video Encode Bandwidth (SDR) lists H.264, H.265 and AV1.

H.264, H.265 (HEVC), AV11Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026VPU Encode: 4K UHD 30 fps 8-bit recording with H.264, HEVC (H.265) and AV1.

Hardware video decodeiCodecs the chip maker states the integrated GPU decodes in hardware.

H.264, H.265 (HEVC), VP9, AV11Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Max Video Decode Bandwidth lists MPEG2, VC1, VP9, H.264 and H.265. The page's cell is cut off after a last 1080p960 8/10bpc entry, so AV1 decode is taken from AMD's AMF wiki.2Maker product pagegithub.com/GPUOpen-LibrariesAndSDKs/AMF/wiki/GPU-and-APU-HW-Features-and-SupportRead 14 October 2026AMD AMF wiki lists Ryzen 8xxx (Phoenix) with VCN 4.0. The VCN 4.0 row shows AVC, HEVC, VP9 and AV1 decode, and AVC, HEVC and AV1 encode. The table is per chip family, not per processor number, and Hawk Point uses the Phoenix silicon.

H.264, H.265 (HEVC), VP9, AV11Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026VPU Decode: 4K 30 fps 10-bit playback with HEVC (H.265), VP9 and AV1, and 4K 60 fps 8-bit playback with H.264 and HEVC (H.265).

NPU

2 of 2 differ

NPU performanceiNPU only, as the chip maker states it. CPU and GPU AI throughput are not included. Precision, usually INT8, belongs in the source note.

16TOPS1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026NPU TOPS: Up to 16 TOPS. AMD's page names no precision.

45TOPS1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026Qualcomm Hexagon NPU, TOPS: 45 TOPS. The brief does not state the precision. It gives no combined CPU, GPU and NPU figure.

Total AI performanceiThe chip maker's combined AI figure for CPU, GPU and NPU together, e.g. Intel Overall Peak TOPS or AMD Overall TOPS.

38TOPS1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026Overall TOPS: Up to 38 TOPS. AMD's page names no precision.

Not available

Measured performance

None of 7 known

Cinebench 2024 single-coreiMeasured by a reviewer, not claimed by the maker. Compare only results from the same reviewer.

Not available

Not available

Cinebench 2024 multi-coreiMeasured by a reviewer, not claimed by the maker. Compare only results from the same reviewer.

Not available

Not available

Cinebench 2026 single-threadiMeasured by a reviewer, not claimed by the maker. The CPU (Single Thread) test, not the CPU (Single Core) test with the core's second thread. Compare only results from the same reviewer.

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Cinebench 2026 multi-coreiMeasured by a reviewer, not claimed by the maker. The CPU (Multiple Threads) test. Not comparable with Cinebench 2024. Compare only results from the same reviewer.

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Geekbench 6 single-coreiMeasured by a reviewer, not claimed by the maker. Geekbench 6 only. Geekbench 7 has another scale and is not stored here. Intel Binary Optimization on or off goes in the source note. Store results with it off. Compare only results from the same reviewer.

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Geekbench 6 multi-coreiMeasured by a reviewer, not claimed by the maker. Geekbench 6 only. Geekbench 7 has another scale and is not stored here. Intel Binary Optimization on or off goes in the source note. Store results with it off. Compare only results from the same reviewer.

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Game frame ratesiReviewer game results with this processor and the named graphics card, at native resolution with no upscaling and ray tracing off unless the source note says otherwise. Intel Binary Optimization or APO on or off goes in the source note. Store only results with it off. Compare only results from the same reviewer. A 99th percentile frame rate, as Tom's Hardware prints it, is stored as the 1 % low.

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Measured power and temperature

None of 5 known

CPU power in multi-thread load (measured)iMeasured by a reviewer, not claimed by the maker. CPU package power in a sustained all-core load such as Cinebench multi-core. Not wall power. Compare only results from the same reviewer.

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CPU power while gaming (measured)iMeasured by a reviewer, not claimed by the maker. Average CPU package power while gaming. Not wall power. Compare only results from the same reviewer. Intel Binary Optimization or APO on or off goes in the source note. A geomean that mixes games with it on and off is left out.

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CPU power at idle (measured)iMeasured by a reviewer, not claimed by the maker. CPU package power at the reviewer's idle state. Not wall power. Compare only results from the same reviewer.

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CPU temperature in stress testiMeasured by a reviewer, not claimed by the maker. Highest absolute CPU temperature in a sustained all-core load. A delta over room temperature is not stored. It depends on the cooler. Compare only results from the same reviewer.

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All-core clock in stress testiMeasured by a reviewer, not claimed by the maker. Sustained clock under an all-core load. On chips with several core groups, the clock of the group with the highest rated clock, such as Intel P-cores, even when another group measures higher. Compare only results from the same reviewer.

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In the box

None of 2 known

Cooler in the boxiA cooler comes in the retail box. Tray versions have none.

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Included cooler

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Links

Not compared

Product page

www.amd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.html1Maker product pageamd.com/en/products/processors/laptop/ryzen/200-series/amd-ryzen-7-260.htmlRead 14 October 2026

www.qualcomm.com/laptops/products/snapdragon-x-plus2Maker product pagequalcomm.com/laptops/products/snapdragon-x-plusRead 15 October 2026Qualcomm's Snapdragon X Plus product page. Its table loads with scripts. The values below come from the structured data in the page's own JSON file (snapdragon-x-plus.model.json).

Spec sheet

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qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdf1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X-Plus-8-Core-Product-Brief.pdfRead 15 October 2026

Manual

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EPREL registration numberiId in the EU energy label database. Each size or model of a series has its own id, so it is per variant.

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Warranty

None of 1 known

Manufacturer warranty (source market)iThe maker's warranty period for the exact SKU or configuration and market named in the source note. It applies only to that stated market, not every regional variant. Statutory consumer rights are excluded. The base term is stored. An extension that needs registration goes in the source note.

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Both are also in the API. Back to all CPUs.