CPUs / Compare

AMD Ryzen AI 7 350 vs Qualcomm Snapdragon X2 Plus X2P-42-100

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Product A: AMD

Ryzen AI 7 350

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B

Product B: Qualcomm

Snapdragon X2 Plus X2P-42-100

34 of 74 known

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Only differences

AAMD Ryzen AI 7 350

BQualcomm Snapdragon X2 Plus X2P-42-100

General

7 of 13 differ

Series

Ryzen AI 300 Series1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Series row: Ryzen AI 300 Series.

Snapdragon X2 Plus1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Qualcomm's Snapdragon X2 Plus product brief (MCN 87-96323-1 Rev B). The comparison table names the platform Snapdragon X2 Plus 6-core.

Model numbersiMaker identifiers for this exact model and its listed variants. Excludes sibling models and other generations.

100-0000016011Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Product ID Tray 100-000001601. AMD lists no boxed product. The Ryzen AI 7 PRO 350 is another product with its own page.

X2P-42-1001Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Comparison table and Specs and Features table, column Snapdragon X2 Plus 6-core: part number X2P-42-100. The same tables list X2P-64-100, the 10-core part, which is another product.

GTIN / EAN

Not available

Not available

AnnouncediThe maker's first announcement of this model. This is separate from first retail availability.

6 January 20252Press releaseamd.com/en/newsroom/press-releases/2025-1-6-amd-announces-expanded-consumer-and-commercial-ai-.htmlRead 14 October 2026AMD press release dated 6 January 2025 (CES, Las Vegas) introduces the new Ryzen AI 7 and Ryzen AI 5 models of the Ryzen AI 300 Series and lists the Ryzen AI 7 350 in its model table. It gives no price.

5 January 20263Press releasequalcomm.com/news/releases/2026/01/empowering-professionals-and-aspiring-creators--snapdragon-x2-plRead 16 October 2026Qualcomm press note dated Jan 5, 2026, Las Vegas (CES): announces the Snapdragon X2 Plus platform, with select devices from leading OEMs available for purchase in 1H26. Some outlets date their coverage 6 January. Wikipedia lists 5 January 2026.

Status

Available1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Product is listed and current on AMD's page.

Available5Press articletechstoriesindia.com/lenovo-ideapad-slim-5x-83rl000mus-oled-snapdragon-x2-plus-price-specs-amazon-us/ampRead 16 October 2026Article of 24 April 2026, updated in August 2026, on the Lenovo IdeaPad Slim 5X 83RL000MUS listed on Amazon US with Snapdragon X2 Plus X2P-42-100, 6C, up to 4.0 GHz, 22 MB cache. Its Amazon widget shows In Stock with a price update of 15 October 2026.

PredecessoriThe model this one directly replaced, in the same line, tier and size, as the maker or a trusted review names it.

Not available

Qualcomm Snapdragon X Plus X1P-42-1007Reviewnotebookcheck.net/Qualcomm-Snapdragon-X2-Plus-X2P-42-100-Processor-Benchmarks-and-Specs.1196970.0.htmlRead 23 October 2026Notebookcheck's X2P-42-100 page calls the 8-core X1P-42-100 the predecessor of the X2P-42-100.

SuccessoriThe model that directly replaced this one, in the same line, tier and size. A revision such as a Slim or OLED model does not count when a next generation exists.

Not available

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Launch price (US)iThe maker's US launch MSRP for the stated configuration, excluding tax. Current store prices and later discounts do not qualify.

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Launch price (EU)iThe maker's euro launch price for the stated configuration, including VAT as published. Current store prices and later discounts do not qualify.

Not available

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MarketsiISO country or region codes where this exact model or variant is sold. A source page's language does not establish availability.

Not available

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ColoursiThe maker's own colour names

Not available

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SegmentiThe segment the chip maker sells it in. Intel calls laptop chips Mobile. AMD laptop chips that also list Desktops, for mini PCs, stay laptop.

Laptop1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Form Factor lists Laptops and Desktops. AMD laptop chips that also list Desktops stay laptop.

Laptop1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026The brief describes ultra-portable devices and Copilot+ class laptops. Qualcomm lists the chip on its laptops product pages.

Instruction setiApple and Qualcomm chips are Arm64. Intel and AMD chips are x86-64.

x86-641Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Supported Extensions list x86-64.

Arm641Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Specs and Features: Architecture ARM64-Compatible.

CodenameiThe chip maker's codename. Intel: the Code Name row without "Products formerly". AMD: the Former Codename row without the socket.

Krackan Point1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Former Codename row reads Krackan Point.

Not available

CPU process (as published)iVerbatim name of the process the CPU cores are made on, e.g. TSMC N3B or Intel 18A.

TSMC 4nm FinFET1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Processor Technology for CPU Cores: TSMC 4nm FinFET. Package Die Count is 1.

3nm1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Process Node: 3NM, shared by both X2 Plus parts. The brief names no foundry. Tom's Hardware and Gigazine name TSMC N3P. Wikipedia's chip list names a mix of N3P and N3X. The sources differ on the exact node, so the maker's wording is stored.

CPU process nodeiThe nm class of the named CPU-core process, as on laptops and desktop PCs: TSMC N3B is 3, Intel 7 is 10, Intel 4 is 7 and Intel 18A is 1.8. The exact name is in CPU process (as published). I/O and graphics dies may use other nodes.

4nm1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026

3nm1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Process Node: 3NM.

AVX-512iThe chip maker lists AVX-512 among the supported instruction extensions.

Yes1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Supported Extensions list includes AVX512.

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Cores and clocks

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Core configurationiOne row per core group the chip maker names. Intel names performance, efficient and low-power efficient cores. AMD names Zen 5 and Zen 5c cores. Qualcomm names prime and performance cores.

AAMD Ryzen AI 7 350

Count	Core	Base clock (GHz)	Max clock (GHz)
4	Zen 5	2	5
4	Zen 5c	2	3.5

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026AMD names no core roles. Processor Architecture reads 4x Zen 5 and 4x Zen 5c, and # of CPU Cores is 8. The page lists Base Clock, Zen5 Base Clock and Zen5c Base Clock all as 2 GHz. Max. Boost Clock is Up to 5 GHz and Max Zen5c Clock is Up to 3.5 GHz. The 5 GHz is the highest single-core clock and is stored for the Zen 5 group.

BQualcomm Snapdragon X2 Plus X2P-42-100

Core type	Count	Core	Max clock (GHz)
Prime	6	Oryon (3rd Gen)	4

Source1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 20263rd Gen Qualcomm Oryon CPU. X2P-42-100 column: Total Cores 6, Prime Cores 6, Performance cores 0, Multi-Core Max Frequency 4.0 GHz, Boost Frequency 4.0 GHz (Single-Core). The brief states no base clock. Total cache is 22 MB and is not split into L2 and L3, so both cache fields are left out. Qualcomm's own 10-core part has 4 Performance cores, this chip has none.

CoresiPhysical cores, not threads.

8=CalculatedFrom Core configuration

6=CalculatedFrom Core configuration

Cores labelled performanceiCounts only cores the chip maker labels performance. Not available when the maker labels no roles, as on AMD chips. Qualcomm and Apple use other labels for their fastest cores.

Not available

0=CalculatedFrom Core configuration

Cores labelled efficiencyiCounts efficient and low-power efficient cores. Not available when the maker labels no roles.

Not available

0=CalculatedFrom Core configuration

ThreadsiHardware threads, including simultaneous multithreading where the chip has it.

161Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Multithreading (SMT) Yes, # of Threads 16.

66Spec databaseeatyourbytes.com/qualcommcpu-detail/qualcomm-snapdragon-x2-plus-x2p-42-100Read 16 October 2026Eat Your Bytes lists 6 cores and 6 threads for the X2P-42-100. Qualcomm's brief states no thread count. ASUS's tech spec page for the Vivobook S16 states 18 cores and 18 threads for the 18-core X2 Elite, so the X2 Oryon cores run one thread each. Other values on the page, such as TDP 22 W and a TSMC N3 process, are not used. No second source was opened for the thread count.

Max boost clockiHighest clock the chip maker states for the processor, Intel Max Turbo Frequency or AMD Max. Boost Clock. Often reached on one or two cores only. It can be higher than every core group's max clock.

5GHz1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026

4GHz1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Boost Frequency 4.0 GHz (Single-Core) for X2P-42-100. Tom's Hardware prints 4.04 GHz for the single-core boost, the brief rounds to 4.0 GHz.

Unlocked for overclockingiThe core multiplier is unlocked, as on Intel K models and AMD chips listed as Unlocked for Overclocking. Memory profiles such as XMP or EXPO alone do not count.

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Cache

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L2 cacheiTotal L2 cache of all cores.

8MB1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026L2 Cache 8 MB.

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L3 cacheiTotal L3 cache, including 3D V-Cache. Intel Smart Cache is L3. L2 is not added. A total cache figure from Qualcomm or Apple is not L3.

16MB1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026L3 Cache 16 MB. AMD's CES table lists 24 MB, which is L2 plus L3 together.

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AMD 3D V-CacheiExtra L3 cache stacked on a compute die. Yes when at least one compute die has it.

No1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026AMD lists 16 MB L3 and no stacked cache.

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Power and thermals

3 of 4 differ

Base power (TDP)iIntel Processor Base Power or AMD Default TDP. A rating for cooler and board design, not measured power draw. A Default TDP printed as a range, such as 35-54 W, is not stored.

28W1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Default TDP 28W.

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Max turbo poweriHighest package power limit at stock settings. Intel Maximum Turbo Power, or AMD's package power tracking (PPT) limit. The source note says which. Only a source that names this exact chip counts. A database value applied to a whole class of chips does not.

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Configurable power rangeiThe sustained power range a PC or laptop maker may set. AMD cTDP. Intel Minimum and Maximum Assured Power.

Minimum15Maximum54W1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026AMD Configurable TDP (cTDP) 15-54W.

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Max operating temperatureiHighest die temperature the chip maker allows, called Tjmax or Tjunction. The chip lowers its clocks to stay below it.

100°C1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Max. Operating Temperature (Tjmax) 100C.

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Memory

5 of 6 differ

Memory supportiOfficial memory speeds per memory type, module type and module configuration, as the chip maker states them.

AAMD Ryzen AI 7 350

Memory type	Module type	Modules	Max speed (MT/s)
DDR5	Not available	4x2R	5,600
LPDDR5X	Soldered	Not available	8,000

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026System Memory Type: DDR5 (FP8) and LPDDR5X (FP8). The Max Memory Speed row is labelled 4x2R and reads LPDDR5x-8000 and DDR5-5600, so the DDR5 row keeps that label. AMD names no module type for DDR5. LPDDR5X is soldered to the board and has no module configuration.

BQualcomm Snapdragon X2 Plus X2P-42-100

Memory type	Max speed (MT/s)
LPDDR5X	9,523

Source1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Memory Type LPDDR5x, Transfer Rate 9523 MT/s. The brief names no module type or configuration, so those are left out.

Max memory speed (official)iHighest official speed in the memory support table, for any module type. Four modules or plain UDIMMs can run slower. Intel quotes some chips with CUDIMM speeds only.

8,000MT/s=CalculatedFrom Memory support

9,523MT/s=CalculatedFrom Memory support

Memory channelsiCounted in 64-bit channels, as Intel and AMD count them. A DDR5 module has two 32-bit subchannels and makers count it as one channel. A maker that counts narrower channels and states their width is converted by the total bus width, so Qualcomm's 8 channels of 16 bits are 2. A total bus width alone is divided by 64, so AMD's 256-bit interface is 4. The maker's own count goes in the source note.

21Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Memory Channels 2.

21Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Memory: Bus Width 128-bit. The field counts 64-bit channels, so 128 bits is 2.

Memory bandwidth (claimed)iPeak memory bandwidth the chip maker states. Not a measurement.

Not available

152GB/s1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Memory: Bandwidth 152 GB/s.

Max memoryiMost memory the chip maker says the processor supports. When the limit depends on the device, as for Apple chips, the highest limit the maker states for this chip in any device. The device goes in the source note. When Intel's documents differ, such as 192 GB in a launch brief and 256 GB on its spec page, the current spec page wins, since newer memory modules can raise the limit.

256GB1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Max. Memory 256 GB, as AMD states it for both memory types together.

128GB1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Memory: Max Capacity 128 GB.

ECC memory supportiThe chip maker says the processor supports ECC memory. Most need a board that supports it too. DDR5 on-die ECC does not count.

No1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026ECC Support: No.

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Platform

5 of 7 differ

Socket or packageiDesktop socket, e.g. AM5 or LGA1851. Laptop chips are soldered, so this is the package the maker names, e.g. FP8. When the maker names several packages, in the socket row or the product IDs, list them all separated by commas, such as "FP7, FP7r2".

FP81Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026CPU Socket row reads FP8.

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Compatible chipsetsiDesktop chipsets the chip maker lists, with the brand and without the word chipset, e.g. AMD X870E, AMD B850 or Intel Z890. Same form as the motherboard chipset.

Not available

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CPU PCIe lanesiUsable PCIe lanes from the processor, one row per PCIe generation. Lanes that link the CPU to the chipset are not counted. If the maker gives only a total, a review that lists the split may be used, and the source note names it. When the package also holds the chipset, as on Intel Raptor Lake U and H chips, ARK's total includes the chipset lanes. Those are not counted, so the datasheet split is used. On Intel Core Ultra chips, such as Panther Lake, the platform controller or SoC tile is part of the processor, so its lanes count.

AAMD Ryzen AI 7 350

PCIe generation	Lanes
4	16

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026PCI Express Version is PCIe 4.0. Native PCIe Lanes (Total/Usable) is 16 and 16.

BQualcomm Snapdragon X2 Plus X2P-42-100

PCIe generation	Lanes
5	8
4	4

Source1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026PCIe section of Specs and Features, shared by both X2 Plus parts: PCIe Gen 5.0 Lanes 8 and PCIe Gen 4.0 Lanes 4. The same brief lists the 5G modem and Wi-Fi interfaces as M.2 PCIe 3.0, and does not say whether those use the Gen 4 lanes. Stored as the maker lists them.

CPU PCIe lanes in totaliUsable lanes from the processor. Lanes to the chipset are not counted.

16=CalculatedFrom CPU PCIe lanes

12=CalculatedFrom CPU PCIe lanes

Highest PCIe generationiHighest PCIe generation of the processor's own lanes. Chipset lanes are not counted.

4=CalculatedFrom CPU PCIe lanes

5=CalculatedFrom CPU PCIe lanes

Native USB portsiUSB ports the processor itself provides, as the chip maker lists them. The board or laptop decides which ones reach a connector. Chipset ports are not counted. eUSB2 is the embedded USB 2.0 link that Qualcomm lists. It needs a repeater on the board to become a USB 2.0 port.

AAMD Ryzen AI 7 350

Standard	Count
USB4	2
USB 3.2 Gen 2 (10 Gbps)	3
USB 2.0	3

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Native USB 4 (40Gbps) 2, Native USB 3.2 Gen 2 (10Gbps) 3 and Native USB 2.0 (480Mbps) 3.

BQualcomm Snapdragon X2 Plus X2P-42-100

Standard	Count
USB4	3

Source1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026USB: USB4 (40 Gbps) with Interface Type 3x USB-C. The brief lists no other USB ports.

Native USB4 or ThunderboltiThe processor itself provides USB4 or Thunderbolt. The board or laptop must still wire it to a port.

Yes=CalculatedFrom Native USB ports

Yes=CalculatedFrom Native USB ports

Integrated graphics

7 of 9 differ

Integrated graphicsiNo for chips that need a graphics card, such as Intel F models.

Yes1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026

Yes1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Qualcomm Adreno GPU, Part Number X2-45, API support DirectX 12.2 Ultimate, Vulkan 1.4, OpenCL 3.0.

Integrated GPUiAs the chip maker names it.

AMD Radeon 860M1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Graphics Model: AMD Radeon 860M.

Qualcomm Adreno X2-451Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Qualcomm Adreno GPU, Part Number X2-45. The brief states no GPU core count.

GPU coresiAs the chip maker counts them: AMD compute units, Intel Xe-cores, Apple GPU cores. Counts from different makers are not comparable. Intel execution units (EUs) are not Xe-cores and are not stored here. Apple sells some chips with two GPU core counts under one name, so it is per variant.

81Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Graphics Core Count 8.

Not available

Max GPU clockiIntel Graphics Max Dynamic Frequency or AMD Graphics Frequency.

3,000MHz1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Graphics Frequency 3000 MHz.

910MHz2Maker product pagequalcomm.com/laptops/products/snapdragon-x2-plusRead 16 October 2026Comparison table, row X2P-42-100: GPU Clock Speed 0.91 GHz, stored as 910 MHz. Specifications footnote 3 ties 0.91 GHz to X2P-42-100. The product brief and Tom's Hardware round it to 0.9 GHz. The 10-core part has 1.7 GHz.

Max displaysiDisplays the integrated GPU drives at the same time. The chip maker's total. Intel counts a built-in laptop panel in it. A count of external displays only, as Qualcomm gives, is left out and goes in the source note.

41Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Max Displays 4.

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DisplayPort versioniHighest DisplayPort version the integrated GPU outputs, with the UHBR rate when stated.

2.1 UHBR101Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026DisplayPort Version 2.1 with the UHBR10 extension.

2.11Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Display: External Display Standard Display Port 2.1, 3 displays at up to 4K at 144 Hz or 5K at 60 Hz. The On-Device Display Standard is eDP 1.5. The X2 Elite brief names DisplayPort 1.4 for the same row, so the X2 Plus value is unusual and is stored as published. The brief counts external displays only, so the max displays field is left out. No HDMI version is stated.

HDMI versioniHighest HDMI version the integrated GPU outputs, as published.

2.11Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026HDMI Version 2.1.

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Hardware video encodeiCodecs the chip maker states the integrated GPU encodes in hardware.

H.264, H.265 (HEVC), AV11Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Max Video Encode Bandwidth (SDR) lists H.264, H.265 and AV1.

H.264, H.265 (HEVC), AV11Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Adreno VPU Encode: HEVC and AVC 8K UHD at 30 FPS, AV1 8K UHD at 15 FPS and UHD at 60 FPS. No VP9 encode is listed.

Hardware video decodeiCodecs the chip maker states the integrated GPU decodes in hardware.

Not available

H.264, H.265 (HEVC), AV11Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Adreno VPU Decode: AV1, HEVC and AVC, 8K at 60 FPS. The brief lists no VP9 decode, so none is stored.

NPU

2 of 2 differ

NPU performanceiNPU only, as the chip maker states it. CPU and GPU AI throughput are not included. Precision, usually INT8, belongs in the source note.

50TOPS1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026NPU TOPS: Up to 50 TOPS. AMD's page names no precision.

80TOPS1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026Qualcomm Hexagon NPU, TOPS (INT8): 80. The brief gives no combined CPU, GPU and NPU figure.

Total AI performanceiThe chip maker's combined AI figure for CPU, GPU and NPU together, e.g. Intel Overall Peak TOPS or AMD Overall TOPS.

66TOPS1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026Overall TOPS: Up to 66 TOPS. AMD's page names no precision.

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Measured performance

None of 7 known

Cinebench 2024 single-coreiMeasured by a reviewer, not claimed by the maker. Compare only results from the same reviewer.

Not available

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Cinebench 2024 multi-coreiMeasured by a reviewer, not claimed by the maker. Compare only results from the same reviewer.

Not available

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Cinebench 2026 single-threadiMeasured by a reviewer, not claimed by the maker. The CPU (Single Thread) test, not the CPU (Single Core) test with the core's second thread. Compare only results from the same reviewer.

Not available

Not available

Cinebench 2026 multi-coreiMeasured by a reviewer, not claimed by the maker. The CPU (Multiple Threads) test. Not comparable with Cinebench 2024. Compare only results from the same reviewer.

Not available

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Geekbench 6 single-coreiMeasured by a reviewer, not claimed by the maker. Geekbench 6 only. Geekbench 7 has another scale and is not stored here. Intel Binary Optimization on or off goes in the source note. Store results with it off. Compare only results from the same reviewer.

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Geekbench 6 multi-coreiMeasured by a reviewer, not claimed by the maker. Geekbench 6 only. Geekbench 7 has another scale and is not stored here. Intel Binary Optimization on or off goes in the source note. Store results with it off. Compare only results from the same reviewer.

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Game frame ratesiReviewer game results with this processor and the named graphics card, at native resolution with no upscaling and ray tracing off unless the source note says otherwise. Intel Binary Optimization or APO on or off goes in the source note. Store only results with it off. Compare only results from the same reviewer. A 99th percentile frame rate, as Tom's Hardware prints it, is stored as the 1 % low.

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Measured power and temperature

None of 5 known

CPU power in multi-thread load (measured)iMeasured by a reviewer, not claimed by the maker. CPU package power in a sustained all-core load such as Cinebench multi-core. Not wall power. Compare only results from the same reviewer.

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CPU power while gaming (measured)iMeasured by a reviewer, not claimed by the maker. Average CPU package power while gaming. Not wall power. Compare only results from the same reviewer. Intel Binary Optimization or APO on or off goes in the source note. A geomean that mixes games with it on and off is left out.

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CPU power at idle (measured)iMeasured by a reviewer, not claimed by the maker. CPU package power at the reviewer's idle state. Not wall power. Compare only results from the same reviewer.

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CPU temperature in stress testiMeasured by a reviewer, not claimed by the maker. Highest absolute CPU temperature in a sustained all-core load. A delta over room temperature is not stored. It depends on the cooler. Compare only results from the same reviewer.

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All-core clock in stress testiMeasured by a reviewer, not claimed by the maker. Sustained clock under an all-core load. On chips with several core groups, the clock of the group with the highest rated clock, such as Intel P-cores, even when another group measures higher. Compare only results from the same reviewer.

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In the box

None of 2 known

Cooler in the boxiA cooler comes in the retail box. Tray versions have none.

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Included cooler

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Links

Not compared

Product page

www.amd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.html1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-7-350.htmlRead 14 October 2026

www.qualcomm.com/laptops/products/snapdragon-x2-plus2Maker product pagequalcomm.com/laptops/products/snapdragon-x2-plusRead 16 October 2026Qualcomm's Snapdragon X2 Plus product page. Its table loads with scripts. The values come from the page's markdown version (snapdragon-x2-plus.md).

Spec sheet

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www.qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdf1Maker spec sheet (PDF)qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/Snapdragon-X2-Plus-Product-Brief.pdfRead 16 October 2026

Manual

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EPREL registration numberiId in the EU energy label database. Each size or model of a series has its own id, so it is per variant.

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Warranty

None of 1 known

Manufacturer warranty (source market)iThe maker's warranty period for the exact SKU or configuration and market named in the source note. It applies only to that stated market, not every regional variant. Statutory consumer rights are excluded. The base term is stored. An extension that needs registration goes in the source note.

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Both are also in the API. Back to all CPUs.