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AMD Ryzen AI 9 HX 370 vs AMD Ryzen AI Max+ 395

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Product A: AMD

Ryzen AI 9 HX 370

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Product B: AMD

Ryzen AI Max+ 395

43 of 74 known

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Only differences

AAMD Ryzen AI 9 HX 370

BAMD Ryzen AI Max+ 395

General

3 of 13 differ

Series

Ryzen AI 300 Series1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Series row: Ryzen AI 300 Series.

Ryzen AI Max 300 Series1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Series row: Ryzen AI Max 300 Series.

Model numbersiMaker identifiers for this exact model and its listed variants. Excludes sibling models and other generations.

100-0000009941Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Product ID Tray 100-000000994 (FP8). AMD lists no boxed product.

100-0000010991Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Product ID Tray 100-000001099. AMD lists no boxed product.

GTIN / EAN

Not available

Not available

AnnouncediThe maker's first announcement of this model. This is separate from first retail availability.

2 June 20242Press releaseamd.com/en/newsroom/press-releases/2024-6-2-amd-unveils-next-gen-zen-5-ryzen-processors-to-p.htmlRead 14 October 2026AMD release dated 2 June 2024 (Computex, Taipei) introduces the Ryzen AI 300 Series and lists the Ryzen AI 9 HX 370 with 12 cores and 24 threads, up to 5.1 GHz boost, 2.0 GHz base, 36 MB total cache, Radeon 890M and 15-54 W cTDP. It gives no price and no laptop availability date.

6 January 20252Press releaseir.amd.com/news-events/press-releases/detail/1232/amd-announces-expanded-consumer-and-commercial-ai-pc-portfolioRead 15 October 2026AMD release dated 6 January 2025 (ahead of CES) announces the Ryzen AI Max Series and lists the Ryzen AI Max+ 395 with 16C/32T, up to 5.1 GHz boost, 3.0 GHz base, 80 MB total cache, Radeon 8060S, 45-120W cTDP, 50 NPU TOPS and 40 graphics cores. It says systems are expected to be available starting in Q1 2025 and gives no price.

Status

Available1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Product is listed and current on AMD's page.

Available1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Product is listed and current on AMD's page, with Regional Availability Global.

PredecessoriThe model this one directly replaced, in the same line, tier and size, as the maker or a trusted review names it.

Not available

Not available

SuccessoriThe model that directly replaced this one, in the same line, tier and size. A revision such as a Slim or OLED model does not count when a next generation exists.

Not available

Not available

Launch price (US)iThe maker's US launch MSRP for the stated configuration, excluding tax. Current store prices and later discounts do not qualify.

Not available

Not available

Launch price (EU)iThe maker's euro launch price for the stated configuration, including VAT as published. Current store prices and later discounts do not qualify.

Not available

Not available

MarketsiISO country or region codes where this exact model or variant is sold. A source page's language does not establish availability.

Not available

Not available

ColoursiThe maker's own colour names

Not available

Not available

SegmentiThe segment the chip maker sells it in. Intel calls laptop chips Mobile. AMD laptop chips that also list Desktops, for mini PCs, stay laptop.

Laptop1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Form Factor lists Laptops and Desktops. AMD laptop chips that also list Desktops stay laptop.

Laptop1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Form Factor lists Laptops and Desktops. AMD laptop chips that also list Desktops stay laptop.

Instruction setiApple and Qualcomm chips are Arm64. Intel and AMD chips are x86-64.

x86-641Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Supported Extensions list x86-64.

x86-641Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Supported Extensions list x86-64.

CodenameiThe chip maker's codename. Intel: the Code Name row without "Products formerly". AMD: the Former Codename row without the socket.

Strix Point1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Former Codename row reads Strix Point.

Strix Halo1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Former Codename row reads Strix Halo.

CPU process (as published)iVerbatim name of the process the CPU cores are made on, e.g. TSMC N3B or Intel 18A.

TSMC 4nm FinFET1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Processor Technology for CPU Cores: TSMC 4nm FinFET. Package Die Count is 1.

TSMC 4nm FinFET1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Processor Technology for CPU Cores: TSMC 4nm FinFET. The I/O die is also TSMC 4nm FinFET. Package Die Count is 3.

CPU process nodeiThe nm class of the named CPU-core process, as on laptops and desktop PCs: TSMC N3B is 3, Intel 7 is 10, Intel 4 is 7 and Intel 18A is 1.8. The exact name is in CPU process (as published). I/O and graphics dies may use other nodes.

4nm1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026

4nm1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026TSMC 4nm FinFET is stored as 4 nm.

AVX-512iThe chip maker lists AVX-512 among the supported instruction extensions.

Yes1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Supported Extensions list includes AVX512.

Yes1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Supported Extensions list includes AVX512.

Cores and clocks

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Core configurationiOne row per core group the chip maker names. Intel names performance, efficient and low-power efficient cores. AMD names Zen 5 and Zen 5c cores. Qualcomm names prime and performance cores.

AAMD Ryzen AI 9 HX 370

Count	Core	Base clock (GHz)	Max clock (GHz)
4	Zen 5	2	5.1
8	Zen 5c	2	3.3

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026AMD names no core roles. Processor Architecture reads 4x Zen 5 and 8x Zen 5c, and # of CPU Cores is 12. The page lists Base Clock, Zen5 Base Clock and Zen5c Base Clock all as 2 GHz. Max. Boost Clock is Up to 5.1 GHz and Max Zen5c Clock is Up to 3.3 GHz. The 5.1 GHz is the highest single-core clock and is stored for the Zen 5 group.

BAMD Ryzen AI Max+ 395

Count	Core	Base clock (GHz)	Max clock (GHz)
16	Zen 5	3	5.1

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026AMD names no core roles. Processor Architecture reads 16x Zen 5 and # of CPU Cores is 16. Base Clock 3 GHz is AMD's average effective base frequency of all cores. Max. Boost Clock is the highest single-core clock, Up to 5.1 GHz.

CoresiPhysical cores, not threads.

12=CalculatedFrom Core configuration

16=CalculatedFrom Core configuration

Cores labelled performanceiCounts only cores the chip maker labels performance. Not available when the maker labels no roles, as on AMD chips. Qualcomm and Apple use other labels for their fastest cores.

Not available

Not available

Cores labelled efficiencyiCounts efficient and low-power efficient cores. Not available when the maker labels no roles.

Not available

Not available

ThreadsiHardware threads, including simultaneous multithreading where the chip has it.

241Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Multithreading (SMT) Yes, # of Threads 24.

321Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Multithreading (SMT) Yes, # of Threads 32.

Max boost clockiHighest clock the chip maker states for the processor, Intel Max Turbo Frequency or AMD Max. Boost Clock. Often reached on one or two cores only. It can be higher than every core group's max clock.

5.1GHz1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Max. Boost Clock: Up to 5.1 GHz.

5.1GHz1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Max. Boost Clock: Up to 5.1 GHz.

Unlocked for overclockingiThe core multiplier is unlocked, as on Intel K models and AMD chips listed as Unlocked for Overclocking. Memory profiles such as XMP or EXPO alone do not count.

Not available

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Cache

2 of 3 differ

L2 cacheiTotal L2 cache of all cores.

12MB1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026L2 Cache 12 MB.

16MB1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026L2 Cache 16 MB. AMD's launch table lists 80 MB total cache, which is L2 plus L3.

L3 cacheiTotal L3 cache, including 3D V-Cache. Intel Smart Cache is L3. L2 is not added. A total cache figure from Qualcomm or Apple is not L3.

24MB1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026L3 Cache 24 MB. AMD's launch table lists 36 MB total cache, which is L2 plus L3.

64MB1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026L3 Cache 64 MB.

AMD 3D V-CacheiExtra L3 cache stacked on a compute die. Yes when at least one compute die has it.

No1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026AMD lists 24 MB L3 and no stacked cache.

No1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026AMD lists 64 MB L3 and no stacked cache or 3D V-Cache technology.

Power and thermals

2 of 4 differ

Base power (TDP)iIntel Processor Base Power or AMD Default TDP. A rating for cooler and board design, not measured power draw. A Default TDP printed as a range, such as 35-54 W, is not stored.

28W1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Default TDP 28W.

55W1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Default TDP 55W.

Max turbo poweriHighest package power limit at stock settings. Intel Maximum Turbo Power, or AMD's package power tracking (PPT) limit. The source note says which. Only a source that names this exact chip counts. A database value applied to a whole class of chips does not.

Not available

Not available

Configurable power rangeiThe sustained power range a PC or laptop maker may set. AMD cTDP. Intel Minimum and Maximum Assured Power.

Minimum15Maximum54W1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026AMD Configurable TDP (cTDP) 15-54W.

Minimum45Maximum120W1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026AMD Configurable TDP (cTDP) 45-120W.

Max operating temperatureiHighest die temperature the chip maker allows, called Tjmax or Tjunction. The chip lowers its clocks to stay below it.

100°C1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Max. Operating Temperature (Tjmax) 100C.

100°C1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Max. Operating Temperature (Tjmax) 100C.

Memory

5 of 6 differ

Memory supportiOfficial memory speeds per memory type, module type and module configuration, as the chip maker states them.

AAMD Ryzen AI 9 HX 370

Memory type	Module type	Modules	Max speed (MT/s)
DDR5	Not available	2x2R	5,600
LPDDR5X	Soldered	Not available	8,000

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026System Memory Type: DDR5 (FP8) and LPDDR5X (FP8). The Max Memory Speed row is labelled 2x2R and reads DDR5-5600 and LPDDR5x-8000, so the DDR5 row keeps that label. AMD names no module type for DDR5. LPDDR5X is soldered to the board and has no module configuration.

BAMD Ryzen AI Max+ 395

Memory type	Module type	Max speed (MT/s)
LPDDR5X	Soldered	8,000

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026System Memory Type: 256-bit LPDDR5x. Max Memory Speed: LPDDR5x-8000. AMD states no module configuration. The memory is soldered to the board.

Max memory speed (official)iHighest official speed in the memory support table, for any module type. Four modules or plain UDIMMs can run slower. Intel quotes some chips with CUDIMM speeds only.

8,000MT/s=CalculatedFrom Memory support

8,000MT/s=CalculatedFrom Memory support

Memory channelsiCounted in 64-bit channels, as Intel and AMD count them. A DDR5 module has two 32-bit subchannels and makers count it as one channel. A maker that counts narrower channels and states their width is converted by the total bus width, so Qualcomm's 8 channels of 16 bits are 2. A total bus width alone is divided by 64, so AMD's 256-bit interface is 4. The maker's own count goes in the source note.

21Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Memory Channels 2.

44Press articletomshardware.com/pc-components/cpus/amds-beastly-strix-halo-ryzen-ai-max-debuts-with-radical-new-memory-tech-to-feed-rdna-3-5-graphics-and-zen-5-cpu-coresRead 15 October 2026AMD's page states a 256-bit LPDDR5x interface and no channel count. Counted in 64-bit channels, 256 bits is 4 channels. The same Tom's Hardware article quotes 256 GB/s of memory throughput, which fits 4 channels of 64 bits at 8000 MT/s.

Memory bandwidth (claimed)iPeak memory bandwidth the chip maker states. Not a measurement.

Not available

256GB/s4Press articletomshardware.com/pc-components/cpus/amds-beastly-strix-halo-ryzen-ai-max-debuts-with-radical-new-memory-tech-to-feed-rdna-3-5-graphics-and-zen-5-cpu-coresRead 15 October 2026Tom's Hardware, AMD's CES 2025 launch coverage: the Ryzen AI Max+ 395 delivers 256 GB/s of memory throughput. This is the maker's peak figure as reported, and it matches a 256-bit bus at LPDDR5X-8000 (256 bits / 8 x 8000 MT/s).

Max memoryiMost memory the chip maker says the processor supports. When the limit depends on the device, as for Apple chips, the highest limit the maker states for this chip in any device. The device goes in the source note. When Intel's documents differ, such as 192 GB in a launch brief and 256 GB on its spec page, the current spec page wins, since newer memory modules can raise the limit.

256GB1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Max. Memory 256 GB, as AMD states it for both memory types together.

128GB1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Max. Memory 128 GB. AMD's launch release says up to 96 GB of it can be used by the graphics.

ECC memory supportiThe chip maker says the processor supports ECC memory. Most need a board that supports it too. DDR5 on-die ECC does not count.

No1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026ECC Support: No.

Not available

Platform

1 of 7 differ

Socket or packageiDesktop socket, e.g. AM5 or LGA1851. Laptop chips are soldered, so this is the package the maker names, e.g. FP8. When the maker names several packages, in the socket row or the product IDs, list them all separated by commas, such as "FP7, FP7r2".

FP81Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026CPU Socket row reads FP8.

FP111Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026CPU Socket row reads FP11.

Compatible chipsetsiDesktop chipsets the chip maker lists, with the brand and without the word chipset, e.g. AMD X870E, AMD B850 or Intel Z890. Same form as the motherboard chipset.

Not available

Not available

CPU PCIe lanesiUsable PCIe lanes from the processor, one row per PCIe generation. Lanes that link the CPU to the chipset are not counted. If the maker gives only a total, a review that lists the split may be used, and the source note names it. When the package also holds the chipset, as on Intel Raptor Lake U and H chips, ARK's total includes the chipset lanes. Those are not counted, so the datasheet split is used. On Intel Core Ultra chips, such as Panther Lake, the platform controller or SoC tile is part of the processor, so its lanes count.

AAMD Ryzen AI 9 HX 370

PCIe generation	Lanes
4	16

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026PCI Express Version is PCIe 4.0. Native PCIe Lanes (Total/Usable) is 16 and 16.

BAMD Ryzen AI Max+ 395

PCIe generation	Lanes
4	16

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026PCI Express Version is PCIe 4.0. Native PCIe Lanes (Total/Usable) is 16 and 16.

CPU PCIe lanes in totaliUsable lanes from the processor. Lanes to the chipset are not counted.

16=CalculatedFrom CPU PCIe lanes

16=CalculatedFrom CPU PCIe lanes

Highest PCIe generationiHighest PCIe generation of the processor's own lanes. Chipset lanes are not counted.

4=CalculatedFrom CPU PCIe lanes

4=CalculatedFrom CPU PCIe lanes

Native USB portsiUSB ports the processor itself provides, as the chip maker lists them. The board or laptop decides which ones reach a connector. Chipset ports are not counted. eUSB2 is the embedded USB 2.0 link that Qualcomm lists. It needs a repeater on the board to become a USB 2.0 port.

AAMD Ryzen AI 9 HX 370

Standard	Count
USB4	2
USB 3.2 Gen 2 (10 Gbps)	3
USB 2.0	3

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Native USB 4 (40Gbps) 2, Native USB 3.2 Gen 2 (10Gbps) 3 and Native USB 2.0 (480Mbps) 3.

BAMD Ryzen AI Max+ 395

Standard	Count
USB4	2
USB 3.2 Gen 2 (10 Gbps)	3
USB 2.0	3

Source1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Native USB 4 (40Gbps) 2, Native USB 3.2 Gen 2 (10Gbps) 3 and Native USB 2.0 (480Mbps) 3.

Native USB4 or ThunderboltiThe processor itself provides USB4 or Thunderbolt. The board or laptop must still wire it to a port.

Yes=CalculatedFrom Native USB ports

Yes=CalculatedFrom Native USB ports

Integrated graphics

3 of 9 differ

Integrated graphicsiNo for chips that need a graphics card, such as Intel F models.

Yes1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026

Yes1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026

Integrated GPUiAs the chip maker names it.

AMD Radeon 890M1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Graphics Model: AMD Radeon 890M.

AMD Radeon 8060S1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Graphics Model: Radeon 8060S Graphics, written AMD Radeon 8060S in AMD's launch release.

GPU coresiAs the chip maker counts them: AMD compute units, Intel Xe-cores, Apple GPU cores. Counts from different makers are not comparable. Intel execution units (EUs) are not Xe-cores and are not stored here. Apple sells some chips with two GPU core counts under one name, so it is per variant.

161Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Graphics Core Count 16.

401Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Graphics Core Count 40.

Max GPU clockiIntel Graphics Max Dynamic Frequency or AMD Graphics Frequency.

2,900MHz1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Graphics Frequency 2900 MHz.

2,900MHz1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Graphics Frequency 2900 MHz.

Max displaysiDisplays the integrated GPU drives at the same time. The chip maker's total. Intel counts a built-in laptop panel in it. A count of external displays only, as Qualcomm gives, is left out and goes in the source note.

41Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Max Displays 4.

41Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Max Displays 4.

DisplayPort versioniHighest DisplayPort version the integrated GPU outputs, with the UHBR rate when stated.

2.1 UHBR101Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026DisplayPort Version 2.1 with the UHBR10 extension.

2.1 UHBR201Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026DisplayPort Version 2.1 with the extensions Adaptive-Sync, HDR Metadata and UHBR20.

HDMI versioniHighest HDMI version the integrated GPU outputs, as published.

2.11Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026HDMI Version 2.1.

2.11Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026HDMI Version 2.1.

Hardware video encodeiCodecs the chip maker states the integrated GPU encodes in hardware.

H.264, H.265 (HEVC), AV11Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Max Video Encode Bandwidth (SDR) lists H.264, H.265 and AV1.

H.264, H.265 (HEVC), AV11Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Max Video Encode Bandwidth (SDR) lists H.264, H.265 and AV1.

Hardware video decodeiCodecs the chip maker states the integrated GPU decodes in hardware.

H.264, H.265 (HEVC), VP9, AV11Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Max Video Decode Bandwidth lists MPEG2, VC1, VP9, H.264 and H.265. The page's cell is cut off after a last 1080p960 8/10bpc entry with no codec name, so AV1 decode is taken from Guru3D.5Reviewguru3d.com/review/review-amd-ryzen-ai-9-370-and-radeon-880m-in-the-acemagic-f3a-mini-pc/page-2Read 14 October 2026Guru3D review of the Ryzen AI 9 HX 370 in the Acemagic F3A mini PC, 8 April 2025: the Radeon 890M takes care of video encoding and decoding for AVC, HEVC, VP9 and AV1. AMD's page lists H.264, H.265 and VP9 decode and its row is cut off before the last entry.

H.264, H.265 (HEVC), VP9, AV11Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Max Video Decode Bandwidth lists H.264, VP9, H.265, AV1 and MJPEG. MJPEG is not an option in the schema.

NPU

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NPU performanceiNPU only, as the chip maker states it. CPU and GPU AI throughput are not included. Precision, usually INT8, belongs in the source note.

50TOPS1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026NPU TOPS: Up to 50 TOPS. AMD's page names no precision. Guru3D says 50 INT8 TOPS.

50TOPS1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026NPU TOPS: Up to 50 TOPS. AMD's page names no precision.

Total AI performanceiThe chip maker's combined AI figure for CPU, GPU and NPU together, e.g. Intel Overall Peak TOPS or AMD Overall TOPS.

80TOPS1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026Overall TOPS: Up to 80 TOPS. AMD's page names no precision.

126TOPS1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026Overall TOPS: Up to 126 TOPS. AMD's page names no precision. FP16 AI Compute is listed separately as up to 60 TFLOPS.

Measured performance

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Cinebench 2024 single-coreiMeasured by a reviewer, not claimed by the maker. Compare only results from the same reviewer.

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Cinebench 2024 multi-coreiMeasured by a reviewer, not claimed by the maker. Compare only results from the same reviewer.

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Cinebench 2026 single-threadiMeasured by a reviewer, not claimed by the maker. The CPU (Single Thread) test, not the CPU (Single Core) test with the core's second thread. Compare only results from the same reviewer.

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Cinebench 2026 multi-coreiMeasured by a reviewer, not claimed by the maker. The CPU (Multiple Threads) test. Not comparable with Cinebench 2024. Compare only results from the same reviewer.

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Geekbench 6 single-coreiMeasured by a reviewer, not claimed by the maker. Geekbench 6 only. Geekbench 7 has another scale and is not stored here. Intel Binary Optimization on or off goes in the source note. Store results with it off. Compare only results from the same reviewer.

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Geekbench 6 multi-coreiMeasured by a reviewer, not claimed by the maker. Geekbench 6 only. Geekbench 7 has another scale and is not stored here. Intel Binary Optimization on or off goes in the source note. Store results with it off. Compare only results from the same reviewer.

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Game frame ratesiReviewer game results with this processor and the named graphics card, at native resolution with no upscaling and ray tracing off unless the source note says otherwise. Intel Binary Optimization or APO on or off goes in the source note. Store only results with it off. Compare only results from the same reviewer. A 99th percentile frame rate, as Tom's Hardware prints it, is stored as the 1 % low.

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Measured power and temperature

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CPU power in multi-thread load (measured)iMeasured by a reviewer, not claimed by the maker. CPU package power in a sustained all-core load such as Cinebench multi-core. Not wall power. Compare only results from the same reviewer.

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CPU power while gaming (measured)iMeasured by a reviewer, not claimed by the maker. Average CPU package power while gaming. Not wall power. Compare only results from the same reviewer. Intel Binary Optimization or APO on or off goes in the source note. A geomean that mixes games with it on and off is left out.

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CPU power at idle (measured)iMeasured by a reviewer, not claimed by the maker. CPU package power at the reviewer's idle state. Not wall power. Compare only results from the same reviewer.

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CPU temperature in stress testiMeasured by a reviewer, not claimed by the maker. Highest absolute CPU temperature in a sustained all-core load. A delta over room temperature is not stored. It depends on the cooler. Compare only results from the same reviewer.

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All-core clock in stress testiMeasured by a reviewer, not claimed by the maker. Sustained clock under an all-core load. On chips with several core groups, the clock of the group with the highest rated clock, such as Intel P-cores, even when another group measures higher. Compare only results from the same reviewer.

2.67GHz4Measurementtomshardware.com/laptops/gaming-laptops/asus-zenbook-s16-amd-ryzen-ai-9-hx-370-reviewRead 14 October 2026Tom's Hardware review of the Asus Zenbook S16 (Ryzen AI 9 HX 370, 32 GB RAM, 1 TB SSD), published 28 July 2024. Cinebench 2024 run 10 times as a stress test: the Zen 5 cores ran at an average of 2.67 GHz and the Zen 5c cores at 1.9 GHz. The Zen 5 group is the fastest group and is stored. Power mode is not named. Tom's says the chip is rated at 28 W and configured to 17 W TDP out of the box in this laptop, so the clock is far below the 5.1 GHz boost. The same review gives an average CPU temperature of 73.44 C, which is an average and not the highest temperature, so the stress temperature field is left empty. The review gives no single Cinebench 2024 multi-core score, only run values from 821.18 to 844.42 points, so those fields are left empty.

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In the box

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Cooler in the boxiA cooler comes in the retail box. Tray versions have none.

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Included cooler

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Links

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Product page

www.amd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.html1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-9-hx-370.htmlRead 14 October 2026

www.amd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.html1Maker product pageamd.com/en/products/processors/laptop/ryzen/ai-300-series/amd-ryzen-ai-max-plus-395.htmlRead 15 October 2026

Spec sheet

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Manual

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EPREL registration numberiId in the EU energy label database. Each size or model of a series has its own id, so it is per variant.

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Warranty

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Manufacturer warranty (source market)iThe maker's warranty period for the exact SKU or configuration and market named in the source note. It applies only to that stated market, not every regional variant. Statutory consumer rights are excluded. The base term is stored. An extension that needs registration goes in the source note.

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Both are also in the API. Back to all CPUs.