CPUs / Compare

Intel Core Ultra 7 355 vs Qualcomm Snapdragon X X1-26-100

A

Product A: Intel

Core Ultra 7 355

43 of 74 known

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B

Product B: Qualcomm

Snapdragon X X1-26-100

28 of 74 known

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All 74 fields

Every value links to where we found it.

Only differences

AIntel Core Ultra 7 355

BQualcomm Snapdragon X X1-26-100

General

7 of 13 differ

Series

Core Ultra Series 33Maker spec sheet (PDF)download.intel.com/newsroom/2026/CES2026/Intel-CES2026-Core-Ultra-Series-3-Press-Deck.pdfRead 15 October 2026Intel calls the family Intel Core Ultra Series 3. ARK's Product Collection reads Intel Core Ultra Series 3 processors.

Snapdragon X Series1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026The brief calls the family Snapdragon X Series and the platform Snapdragon X.

Model numbersiMaker identifiers for this exact model and its listed variants. Excludes sibling models and other generations.

QQ807293B9B40EF, QQ807293B9B458D2Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/ordering.htmlRead 15 October 2026Ordering codes QQ807293B9B40EF (spec code Q9EX) and QQ807293B9B458D (spec code SA4RF), both Tray, stepping A1, package FCBGA20X. ARK lists no boxed product.

X1-26-1001Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Platform overview table, row Snapdragon X: part number X1-26-100. The same row of the brief covers a second part, X1-26-101, which has another GPU (X1-85 at up to 0.63 GHz). The table prints the first part number with a typo (XI-26-100).

GTIN / EAN

Not available

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AnnouncediThe maker's first announcement of this model. This is separate from first retail availability.

5 January 20263Maker spec sheet (PDF)download.intel.com/newsroom/2026/CES2026/Intel-CES2026-Core-Ultra-Series-3-Press-Deck.pdfRead 15 October 2026Intel's CES 2026 Core Ultra Series 3 press deck, page 21, SKU table: the Core Ultra 7 355 is one of the 14 launch SKUs, with 8 cores and threads, 4.7 GHz P-core max turbo, 12 MB cache, 49 NPU TOPS, 4 Xe-cores, 2.5 GHz GPU, 25 W base power and 55 W maximum turbo power. The deck says pre-orders start on 6 January. Intel's release of 5 January 2026 introduces the Series 3 family.4Press releaseintel.com/content/www/us/en/newsroom/news/artificial-intelligence/ces-2026-intel-core-ultra-series-3-debut-first-built-on-intel-18a.htmlRead 15 October 2026Intel release dated 5 January 2026 (CES): Intel unveiled the Intel Core Ultra Series 3 processors. It names the X9 388H and does not name the 355.

6 January 20253Press articletheregister.com/2025/01/07/qualcomms_snapdragon_x_chipRead 15 October 2026Qualcomm announced the chip at CES 2025. The article is dated 7 January 2025. Wikipedia's list of Qualcomm Snapdragon chips gives the announcement date as 6 January 2025.4Spec databaseen.wikipedia.org/wiki/List_of_Qualcomm_Snapdragon_systems_on_chipsRead 15 October 2026Snapdragon X1 series table, row X1-26-100: announcement date 6 January 2025.

Status

Available1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Marketing Status: Launched. Launch Date: Q1'26. Product Collection: Intel Core Ultra Series 3 processors. Vertical Segment: Mobile.

Available6Retailer pageamazon.com/dp/B0GQB5Q1TJRead 15 October 2026Amazon US listing of the HP OmniBook 3 14 with Snapdragon X X1-26-100 (up to 2.97 GHz, 8 cores), CPU Model Number X1-26-100, which shows the chip in a laptop that is on sale. Qualcomm's product brief for the chip is still published.

PredecessoriThe model this one directly replaced, in the same line, tier and size, as the maker or a trusted review names it.

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SuccessoriThe model that directly replaced this one, in the same line, tier and size. A revision such as a Slim or OLED model does not count when a next generation exists.

Not available

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Launch price (US)iThe maker's US launch MSRP for the stated configuration, excluding tax. Current store prices and later discounts do not qualify.

Not available

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Launch price (EU)iThe maker's euro launch price for the stated configuration, including VAT as published. Current store prices and later discounts do not qualify.

Not available

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MarketsiISO country or region codes where this exact model or variant is sold. A source page's language does not establish availability.

Not available

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ColoursiThe maker's own colour names

Not available

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SegmentiThe segment the chip maker sells it in. Intel calls laptop chips Mobile. AMD laptop chips that also list Desktops, for mini PCs, stay laptop.

Laptop1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Vertical Segment row reads Mobile.

Laptop1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026The brief describes the chip as tailored for Copilot+ PCs and built into your laptop.

Instruction setiApple and Qualcomm chips are Arm64. Intel and AMD chips are x86-64.

x86-641Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Instruction Set: 64-bit. Intel's 64-bit processors are x86-64.

Arm643Press articletheregister.com/2025/01/07/qualcomms_snapdragon_x_chipRead 15 October 2026The Register, 7 January 2025: the X1-26-100 has 8 of Qualcomm's custom Arm-compatible Oryon CPU cores with a maximum multi-core frequency of 3 GHz and 30 MB of total cache.

CodenameiThe chip maker's codename. Intel: the Code Name row without "Products formerly". AMD: the Former Codename row without the socket.

Panther Lake1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Code Name row reads Products formerly Panther Lake.

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CPU process (as published)iVerbatim name of the process the CPU cores are made on, e.g. TSMC N3B or Intel 18A.

Intel 18A1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026CPU Lithography row: Intel 18A. The GPU tile lithography row reads Intel 3.

4nm1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Process Node: 4nm. The brief names no foundry. Wikipedia's chip list names TSMC N4.

CPU process nodeiThe nm class of the named CPU-core process, as on laptops and desktop PCs: TSMC N3B is 3, Intel 7 is 10, Intel 4 is 7 and Intel 18A is 1.8. The exact name is in CPU process (as published). I/O and graphics dies may use other nodes.

1.8nm1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Intel 18A is stored as 1.8 nm by the field rule. Intel prints no nm figure.

4nm1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Process Node: 4nm.

AVX-512iThe chip maker lists AVX-512 among the supported instruction extensions.

No1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Instruction Set Extensions lists Intel SSE4.1, SSE4.2 and AVX2 only.

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Cores and clocks

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Core configurationiOne row per core group the chip maker names. Intel names performance, efficient and low-power efficient cores. AMD names Zen 5 and Zen 5c cores. Qualcomm names prime and performance cores.

AIntel Core Ultra 7 355

Core type	Count	Core	Base clock (GHz)	Max clock (GHz)
Performance	4	Cougar Cove	2.3	4.7
Low-power efficiency	4	Darkmont	1.7	3.5

Source1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026# of Performance-cores 4 with base 2.3 GHz and Max Turbo 4.7 GHz. # of Efficient-cores 0. # of Low Power Efficient-cores 4 with base 1.7 GHz and Max Turbo 3.5 GHz. Total cores 8. ARK also prints an Efficient-core Base Frequency of 1.7 GHz, which has no cores behind it and is not stored. ARK does not name the core architectures. Cougar Cove and Darkmont come from the Chips and Cheese and Igor's Lab Panther Lake articles.5Press articleold.chipsandcheese.com/2025/10/14/panther-lakes-reveal-at-itt-2025Read 15 October 2026Chips and Cheese, 14 October 2025: the smallest Panther Lake configuration has 4 P-cores and 4 LP E-cores, the layout ARK lists for the 355. The P-cores are codenamed Cougar Cove and the E-core Darkmont.6Press articleigorslab.de/en/evolution-or-revolution-intel-panther-lake-including-architecture-efficiency-and-software-integrationRead 15 October 2026Igor's Lab names the compute tile cores as four Cougar Cove-P, eight Darkmont-E and four Darkmont-LP-E cores. The LP E-core row stores Darkmont from this source.

BQualcomm Snapdragon X X1-26-100

Count	Core	Max clock (GHz)
8	Oryon	3

Source1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Qualcomm Oryon CPU, 64-bit architecture, 8 cores, up to 3.0 GHz (2.976). The table footnote reads single-core speeds up to 2.976 GHz and multi-core speeds up to 2.956 GHz. The brief states no base clock and no performance or efficiency roles. Stored as one group, with the headline 3.0 GHz as the max clock. Total Cache is 30 MB, which Qualcomm does not split into L2 and L3, so both cache fields are left out.

CoresiPhysical cores, not threads.

8=CalculatedFrom Core configuration

8=CalculatedFrom Core configuration

Cores labelled performanceiCounts only cores the chip maker labels performance. Not available when the maker labels no roles, as on AMD chips. Qualcomm and Apple use other labels for their fastest cores.

4=CalculatedFrom Core configuration

Not available

Cores labelled efficiencyiCounts efficient and low-power efficient cores. Not available when the maker labels no roles.

4=CalculatedFrom Core configuration

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ThreadsiHardware threads, including simultaneous multithreading where the chip has it.

81Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Total Threads 8. There are no multi-threaded cores in this layout: 8 cores and 8 threads.

85Spec databasegeektopia.es/es/product/qualcomm/snapdragon-x-x1-26-100Read 15 October 2026Geektopia lists 8 total cores and 8 threads for the X1-26-100. Qualcomm's brief states no thread count. The page has other values that differ from Qualcomm's brief, such as a GPU clock of 900 MHz and an announcement in September 2024, so only the thread count is used. No second source was opened for it.

Max boost clockiHighest clock the chip maker states for the processor, Intel Max Turbo Frequency or AMD Max. Boost Clock. Often reached on one or two cores only. It can be higher than every core group's max clock.

4.7GHz1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Max Turbo Frequency 4.7 GHz, the same as the Performance-core Max Turbo Frequency.

3GHz1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Platform table: Max Multi-core Frequency 3.0 GHz. The exact figures in the footnote are 2.976 GHz single-core and 2.956 GHz multi-core.

Unlocked for overclockingiThe core multiplier is unlocked, as on Intel K models and AMD chips listed as Unlocked for Overclocking. Memory profiles such as XMP or EXPO alone do not count.

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Cache

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L2 cacheiTotal L2 cache of all cores.

Not available

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L3 cacheiTotal L3 cache, including 3D V-Cache. Intel Smart Cache is L3. L2 is not added. A total cache figure from Qualcomm or Apple is not L3.

12MB1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 202612 MB Intel Smart Cache. The Total L2 Cache row is not on ARK.

Not available

AMD 3D V-CacheiExtra L3 cache stacked on a compute die. Yes when at least one compute die has it.

No1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026AMD technology. ARK lists only the 12 MB Smart Cache and no stacked cache.

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Power and thermals

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Base power (TDP)iIntel Processor Base Power or AMD Default TDP. A rating for cooler and board design, not measured power draw. A Default TDP printed as a range, such as 35-54 W, is not stored.

25W1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Processor Base Power 25 W.

Not available

Max turbo poweriHighest package power limit at stock settings. Intel Maximum Turbo Power, or AMD's package power tracking (PPT) limit. The source note says which. Only a source that names this exact chip counts. A database value applied to a whole class of chips does not.

55W1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Maximum Turbo Power 55 W. Intel's launch deck also prints 55 W for this chip.

Not available

Configurable power rangeiThe sustained power range a PC or laptop maker may set. AMD cTDP. Intel Minimum and Maximum Assured Power.

Minimum12W1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Minimum Assured Power 12 W. ARK has no Maximum Assured Power row, so max_w is left out.

Not available

Max operating temperatureiHighest die temperature the chip maker allows, called Tjmax or Tjunction. The chip lowers its clocks to stay below it.

100°C1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Max Operating Temperature 100 C.

Not available

Memory

4 of 6 differ

Memory supportiOfficial memory speeds per memory type, module type and module configuration, as the chip maker states them.

AIntel Core Ultra 7 355

Memory type	Max speed (MT/s)
LPDDR5X	7,467
DDR5	6,400

Source1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Memory Types row: Up to LPDDR5X 7467 MT/s and Up to DDR5 6400 MT/s. ARK names no module type, rank or configuration, so those keys are left out. Intel's January 2026 launch deck lists LP5/X 6800 and DDR5 6400 for this chip, which conflicts with ARK on LPDDR5X. The Register's launch report says the lower SKUs top out at 8,533, 7,467 or 6,800 MT/s depending on the SKU. ARK is the maker's current page and is stored.

BQualcomm Snapdragon X X1-26-100

Memory type	Max speed (MT/s)
LPDDR5X	8,448

Source1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Memory Type: LPDDR5x with Transfer Rate 8448 MT/s. The brief names no module type or configuration, so those are left out.

Max memory speed (official)iHighest official speed in the memory support table, for any module type. Four modules or plain UDIMMs can run slower. Intel quotes some chips with CUDIMM speeds only.

7,467MT/s=CalculatedFrom Memory support

8,448MT/s=CalculatedFrom Memory support

Memory channelsiCounted in 64-bit channels, as Intel and AMD count them. A DDR5 module has two 32-bit subchannels and makers count it as one channel. A maker that counts narrower channels and states their width is converted by the total bus width, so Qualcomm's 8 channels of 16 bits are 2. A total bus width alone is divided by 64, so AMD's 256-bit interface is 4. The maker's own count goes in the source note.

21Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Max # of Memory Channels: 2.

21Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Memory section: Number of Channels 8 with Bit Width 16-bit per channel, which is 128 bits in total. The field counts 64-bit channels, so 128 bits is stored as 2. Qualcomm's own count is 8.

Memory bandwidth (claimed)iPeak memory bandwidth the chip maker states. Not a measurement.

Not available

135GB/s1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Bandwidth: 135 GB/s. The same Memory section lists Number of Channels: 8 with Bit Width 16-bit per channel, which is 128 bits in total.

Max memoryiMost memory the chip maker says the processor supports. When the limit depends on the device, as for Apple chips, the highest limit the maker states for this chip in any device. The device goes in the source note. When Intel's documents differ, such as 192 GB in a launch brief and 256 GB on its spec page, the current spec page wins, since newer memory modules can raise the limit.

128GB1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Max Memory Size (dependent on memory type): 128 GB. Intel's launch deck lists 96 GB for LPDDR5X and 128 GB for DDR5.

64GB1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Capacity: Up to 64 GB.

ECC memory supportiThe chip maker says the processor supports ECC memory. Most need a board that supports it too. DDR5 on-die ECC does not count.

Not available

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Platform

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Socket or packageiDesktop socket, e.g. AM5 or LGA1851. Laptop chips are soldered, so this is the package the maker names, e.g. FP8. When the maker names several packages, in the socket row or the product IDs, list them all separated by commas, such as "FP7, FP7r2".

BGA25401Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Sockets Supported: FCBGA2540. Stored without the FC prefix.

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Compatible chipsetsiDesktop chipsets the chip maker lists, with the brand and without the word chipset, e.g. AMD X870E, AMD B850 or Intel Z890. Same form as the motherboard chipset.

Not available

Not available

CPU PCIe lanesiUsable PCIe lanes from the processor, one row per PCIe generation. Lanes that link the CPU to the chipset are not counted. If the maker gives only a total, a review that lists the split may be used, and the source note names it. When the package also holds the chipset, as on Intel Raptor Lake U and H chips, ARK's total includes the chipset lanes. Those are not counted, so the datasheet split is used. On Intel Core Ultra chips, such as Panther Lake, the platform controller or SoC tile is part of the processor, so its lanes count.

AIntel Core Ultra 7 355

PCIe generation	Lanes
5	4
4	8

Source1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026PCI Express Revision 5.0 and 4.0. Configurations: x4 PCIe5 (1x4, 2x2), x4 PCIe4 (1x4, 2x2, 4x1) and a second x4 PCIe4 group. Max # of PCI Express Lanes 12. That is 4 Gen 5 lanes and 8 Gen 4 lanes. The platform controller tile is part of the processor, so its lanes count. Chips and Cheese describes the same split for the smallest Panther Lake configuration.5Press articleold.chipsandcheese.com/2025/10/14/panther-lakes-reveal-at-itt-2025Read 15 October 2026The smallest configuration's platform controller tile has 12 PCIe lanes split between 4 Gen 5 lanes and 8 Gen 4 lanes. This matches the ARK configuration rows.

BQualcomm Snapdragon X X1-26-100

Not available

CPU PCIe lanes in totaliUsable lanes from the processor. Lanes to the chipset are not counted.

12=CalculatedFrom CPU PCIe lanes

Not available

Highest PCIe generationiHighest PCIe generation of the processor's own lanes. Chipset lanes are not counted.

5=CalculatedFrom CPU PCIe lanes

Not available

Native USB portsiUSB ports the processor itself provides, as the chip maker lists them. The board or laptop decides which ones reach a connector. Chipset ports are not counted. eUSB2 is the embedded USB 2.0 link that Qualcomm lists. It needs a repeater on the board to become a USB 2.0 port.

AIntel Core Ultra 7 355

Standard
Thunderbolt 4

Source1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Intel Thunderbolt 4: Yes. ARK has no USB rows and gives no Thunderbolt count, so the row has no count. Chips and Cheese says the smallest configuration has 4 Thunderbolt 4 controllers, 2 USB 3.2 and 8 USB 2.0 ports on the platform controller tile. Those counts are for the die configuration, not this SKU, and are not stored.

BQualcomm Snapdragon X X1-26-100

Standard	Count
USB4	3
USB 3.2 Gen 2 (10 Gbps)	2
eUSB2	1

Source1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026USB Specification Version USB 4.0. Interface Type: 3 x USB4 (40Gbps), 2 x USB3.2 Gen2x1 and 1 x eUSB2.

Native USB4 or ThunderboltiThe processor itself provides USB4 or Thunderbolt. The board or laptop must still wire it to a port.

Yes=CalculatedFrom Native USB ports

Yes=CalculatedFrom Native USB ports

Integrated graphics

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Integrated graphicsiNo for chips that need a graphics card, such as Intel F models.

Yes1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026

Yes1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026

Integrated GPUiAs the chip maker names it.

Intel Graphics1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026GPU Name: Intel Graphics.

Qualcomm Adreno X1-451Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Qualcomm Adreno GPU, GPU Part Number X1-45 for the X1-26-100. Up to 1.7 TFLOPS. The brief states no GPU core count.

GPU coresiAs the chip maker counts them: AMD compute units, Intel Xe-cores, Apple GPU cores. Counts from different makers are not comparable. Intel execution units (EUs) are not Xe-cores and are not stored here. Apple sells some chips with two GPU core counts under one name, so it is per variant.

41Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Xe-cores: 4. Execution Units row is absent.

Not available

Max GPU clockiIntel Graphics Max Dynamic Frequency or AMD Graphics Frequency.

2,500MHz1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Graphics Max Dynamic Frequency 2.5 GHz.

1,250MHz1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Clock Speed: Up to 1.25 GHz for the X1-26-100, stored as 1250 MHz.

Max displaysiDisplays the integrated GPU drives at the same time. The chip maker's total. Intel counts a built-in laptop panel in it. A count of external displays only, as Qualcomm gives, is left out and goes in the source note.

41Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026# of Displays Supported: 4.

Not available

DisplayPort versioniHighest DisplayPort version the integrated GPU outputs, with the UHBR rate when stated.

2.1 UHBR201Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Graphics Output: eDP1.5, DP 2.1 UHBR20, HDMI 2.1 FRL.

1.41Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Max. External Display Resolution: DP v1.4 with 3 displays up to UHD 60 Hz HDR10. The internal panel uses eDP v1.4b. The brief states three external displays and does not say how many displays run at once with the internal panel, so the max displays field is left out. It states no HDMI version.

HDMI versioniHighest HDMI version the integrated GPU outputs, as published.

2.1 FRL1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Graphics Output: eDP1.5, DP 2.1 UHBR20, HDMI 2.1 FRL.

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Hardware video encodeiCodecs the chip maker states the integrated GPU encodes in hardware.

H.264, H.265 (HEVC), AV11Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Encode/Decode rows: H.264 Yes, H.265 (HEVC) Yes, AV1 Yes, H.266 (VVC) Decode Only.

H.264, H.265 (HEVC), AV11Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026VPU Encode: 4K UHD 30 fps 8-bit recording with H.264, HEVC (H.265) and AV1.

Hardware video decodeiCodecs the chip maker states the integrated GPU decodes in hardware.

H.264, H.265 (HEVC), AV1, H.266 (VVC)1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026Encode/Decode rows: H.264 Yes, H.265 (HEVC) Yes, AV1 Yes and H.266 (VVC) Decode Only. ARK has no VP9 row, so VP9 is left out.

H.264, H.265 (HEVC), VP9, AV11Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026VPU Decode: 4K 30 fps 10-bit playback with HEVC (H.265), VP9 and AV1, and 4K 60 fps 8-bit playback with H.264 and HEVC (H.265). The PDF line for H.264 and HEVC is cut off at the page edge.

NPU

1 of 2 differ

NPU performanceiNPU only, as the chip maker states it. CPU and GPU AI throughput are not included. Precision, usually INT8, belongs in the source note.

49TOPS1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026NPU Peak TOPS (Int8): 49. ARK has no Overall Peak TOPS row, so platform_tops is left out.

45TOPS1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026Qualcomm Hexagon NPU, TOPS: 45 TOPS. The brief does not state the precision. The brief gives no combined CPU, GPU and NPU figure.

Total AI performanceiThe chip maker's combined AI figure for CPU, GPU and NPU together, e.g. Intel Overall Peak TOPS or AMD Overall TOPS.

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Measured performance

None of 7 known

Cinebench 2024 single-coreiMeasured by a reviewer, not claimed by the maker. Compare only results from the same reviewer.

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Cinebench 2024 multi-coreiMeasured by a reviewer, not claimed by the maker. Compare only results from the same reviewer.

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Cinebench 2026 single-threadiMeasured by a reviewer, not claimed by the maker. The CPU (Single Thread) test, not the CPU (Single Core) test with the core's second thread. Compare only results from the same reviewer.

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Cinebench 2026 multi-coreiMeasured by a reviewer, not claimed by the maker. The CPU (Multiple Threads) test. Not comparable with Cinebench 2024. Compare only results from the same reviewer.

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Geekbench 6 single-coreiMeasured by a reviewer, not claimed by the maker. Geekbench 6 only. Geekbench 7 has another scale and is not stored here. Intel Binary Optimization on or off goes in the source note. Store results with it off. Compare only results from the same reviewer.

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Geekbench 6 multi-coreiMeasured by a reviewer, not claimed by the maker. Geekbench 6 only. Geekbench 7 has another scale and is not stored here. Intel Binary Optimization on or off goes in the source note. Store results with it off. Compare only results from the same reviewer.

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Game frame ratesiReviewer game results with this processor and the named graphics card, at native resolution with no upscaling and ray tracing off unless the source note says otherwise. Intel Binary Optimization or APO on or off goes in the source note. Store only results with it off. Compare only results from the same reviewer. A 99th percentile frame rate, as Tom's Hardware prints it, is stored as the 1 % low.

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Measured power and temperature

None of 5 known

CPU power in multi-thread load (measured)iMeasured by a reviewer, not claimed by the maker. CPU package power in a sustained all-core load such as Cinebench multi-core. Not wall power. Compare only results from the same reviewer.

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CPU power while gaming (measured)iMeasured by a reviewer, not claimed by the maker. Average CPU package power while gaming. Not wall power. Compare only results from the same reviewer. Intel Binary Optimization or APO on or off goes in the source note. A geomean that mixes games with it on and off is left out.

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CPU power at idle (measured)iMeasured by a reviewer, not claimed by the maker. CPU package power at the reviewer's idle state. Not wall power. Compare only results from the same reviewer.

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CPU temperature in stress testiMeasured by a reviewer, not claimed by the maker. Highest absolute CPU temperature in a sustained all-core load. A delta over room temperature is not stored. It depends on the cooler. Compare only results from the same reviewer.

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All-core clock in stress testiMeasured by a reviewer, not claimed by the maker. Sustained clock under an all-core load. On chips with several core groups, the clock of the group with the highest rated clock, such as Intel P-cores, even when another group measures higher. Compare only results from the same reviewer.

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In the box

None of 2 known

Cooler in the boxiA cooler comes in the retail box. Tray versions have none.

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Included cooler

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Links

Not compared

Product page

www.intel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.html1Maker product pageintel.com/content/www/us/en/products/sku/245722/intel-core-ultra-7-processor-355-12m-cache-up-to-4-70-ghz/specifications.htmlRead 15 October 2026

www.qualcomm.com/laptops/products/snapdragon-x2Maker product pagequalcomm.com/laptops/products/snapdragon-xRead 15 October 2026Qualcomm's Snapdragon X product page. Its content loads with scripts and could not be read, so the specification values come from the product brief.

Spec sheet

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docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdf1Maker spec sheet (PDF)docs.qualcomm.com/doc/87-86493-1/87-86493-1_REV_C_Snapdragon_X_Platform_Product_Brief.pdfRead 15 October 2026

Manual

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EPREL registration numberiId in the EU energy label database. Each size or model of a series has its own id, so it is per variant.

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Warranty

None of 1 known

Manufacturer warranty (source market)iThe maker's warranty period for the exact SKU or configuration and market named in the source note. It applies only to that stated market, not every regional variant. Statutory consumer rights are excluded. The base term is stored. An extension that needs registration goes in the source note.

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Both are also in the API. Back to all CPUs.